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Microelectronics Packaging Thermal Engineer
1
Filings
$166,060
Avg Salary
$166,060
Min Salary
$166,060
Max Salary
Salary by Top Employers
Filings for this Role
| Employer | Location | Salary |
|---|---|---|
| IBM Corporation | Hopewell Junction, NY | $166,060 |
Top Cities for this Role
| City | Filings |
|---|---|
| Hopewell Junction, NY | 1 |